Ultrasonic Removal of DYKEM Layout Fluid from Ceramic Substrates Using Detergents for Ceramics

I. Purpose

The purpose of this test was to evaluate the efficiency of the ultrasonic removal of DYKEM layout fluid from ceramic substrates using VALTRON^® detergents.

II. Parameters of the Experiment

Conditioning of the Substrates:
Eight (8) ceramic substrates and several contaminants were submitted for evaluation. In this experiment the removal of DYKEM layout fluid was evaluated. The ceramic substrates were conditioned with the DYKEM layout fluid and allowed to dry overnight.
Preparation of Detergent Solutions:
10% & 15% VALTRON^® SP2200
10% Modified VALTRON^® SP2200 with increased solvent level
15% & 33% VALTRON^® DP054
15% VALTRON^® DP94001
33% Competitive Product

500mL each of the above detergent solutions were prepared in separate 600mL stainless steel beakers. The detergent solutions were degassed for 15 minutes at a temperature of 130°F/54°C or 150°F/66°C in a Blackstone Ney^® ultrasonic unit operating at 40 kHz and 100% power.

III. The Experiment

1. 500mL of 10% VALTRON^® SP2200 were prepared in a 600mL stainless steel beaker. The beaker was placed into a Blackstone Ney^® ultrasonic unit operating at 40 kHz and 100% power, and degassed for 15 minutes at 150°F/66°C.
A ceramic substrate conditioned with DYKEM layout fluid was vertically suspended in the detergent solution and ultrasonically washed for 10 minutes at 150°F/66°C.
The substrate was removed from the ultrasonic wash tank, and it was given a 15-second spray rinse of low-pressure deionized water at room temperature.
Next, the substrate was vertically suspended in deionized water and ultrasonically rinsed for 5 minutes at 150°F/66°C.
The substrate was removed from the ultrasonic rinse tank, and it was given a 15-second spray rinse of low-pressure deionized water at room temperature.
The substrate was allowed to air dry, and then it was inspected under a high-intensity light source for any remaining residue.
Steps 1-6 were repeated using 15% VALTRON^® SP2200, 10% Modified VALTRON^® SP2200, 10% VALTRON^® SP2200 with an ultrasonic wash time of 15 minutes, 15% and 33% VALTRON^® DP054, 15% VALTRON^® DP94001, 33% Competitive Product, & 15% VALTRON^® DP054 at 130°F/54°C.
The results are summarized in Table 1 below.

IV. Results

Table 1: Ultrasonic Removal of DYKEM Layout Fluid from Ceramic Substrates

Contamination	Detergent	Concentration (vol. %)	Ultrasonic Wash		Ultrasonic Rinse		Removal Rate (%)
Contamination	Detergent	Concentration (vol. %)	Time (min.)	Temp. (°F/°C)	Time (min.)	Temp. (°F/°C)	Removal Rate (%)
DYKEM Layout Fluid	VALTRON SP2200	10	10	150/66	5	150/66	95
DYKEM Layout Fluid	VALTRON SP2200	10	15	150/66	5	150/66	95
DYKEM Layout Fluid	VALTRON SP2200	15	10	150/66	5	150/66	95
DYKEM Layout Fluid	Modified VALTRON SP2200	10	10	150/66	5	150/66	95
DYKEM Layout Fluid	VALTRON DP054	15	10	130/54	5	130/54	99
DYKEM Layout Fluid	VALTRON DP054	15	10	150/66	5	150/66	99
DYKEM Layout Fluid	VALTRON DP054	33	10	150/66	5	150/66	99.9
DYKEM Layout Fluid	VALTRON DP94001	15	10	150/66	5	150/66	95
DYKEM Layout Fluid	Competitive Product	33	10	150/66	5	150/66	90

V. Conclusion

Competitive Product detergent was evaluated in the removal of DYKEM layout fluid from ceramic parts and resulted in 90% removal. All VALTRON^® detergents evaluated in this experiment resulted in a higher removal rate than Competitive Product. VALTRON^® DP054 at 15% and 33% dilutions are very effective in the removal of the contamination. Reduction of the temperature from 150°F/66°C to 130°F/54°C resulted in 99% removal of the DYKEM layout fluid.

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