Etching of Silicon Wafers by Soaking Using VALTRON® Alkaline Detergents - Valtech Corporation
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Etching of Silicon Wafers by Soaking
Using Valtron Alkaline Detergents

I. Purpose

The purpose of this test was to determine the etch characteristics of VALTRON® alkaline detergents on silicon wafers by soaking.

 

II. Parameters of the Experiment

  1. Conditioning of the Substrates:
    Several clean silicon wafer pieces were used for evaluation.  No further conditioning was necessary.
  2. Preparation of Detergent Solutions:
    2.25% VALTRON® DP160 pH (concentrate) 13.5
    2.25% VALTRON® DP94001 pH (concentrate) 14.0

    Each of the above solutions were prepared in separate 250mL beakers and heated to and maintained at 194°F/90°C.

 

III. The Experiment

  1. 200mL of 2.25% VALTRON® DP160 was prepared in a 250mL beaker.
  2. The solution was heated to and maintained at 194°F/90°C.
  3. A silicon wafer was immersed into the solution and soaked for 9 minutes to determine the etch characteristics of the bath.
  4. Next, the substrate was given a 15 second spray rinse of low-pressured deionized water at room temperature.
  5. The substrate was allowed to air dry and then it was visually inspected under fluorescent lighting for etching effects.
  6. Steps 1-5 were repeated using 2.25% VALTRON® DP94001.
  7. The results are summarized in Table 1 below.

 

IV. Results

Table 1: Etching of Silicon Wafers by Soaking

VALTRON Detergent Concentration (vol. %) Soak Time
(min.)
Soak Temp. (°F/°C) Observations
DP160 2.25 9 194/90 Solution hazy, small bubbles formed, no foam, evenly etched wafer with no spots
DP94001 2.25 9 194/90 Clear solution, large bubbles, wafer spotty

 

V. Conclusion

The VALTRON® DP160 solution resulted in even etching as compared to VALTRON® DP94001 which resulted in spotting of the wafer.

 

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Compatibility Testing of Lenses | Removal of DYKEM Layout Fluid | Removal of Polishing Compounds
Removal of Contaminants | Effectiveness of Ultrasonic Cleaning | Etching of Silicon Wafers | De-bonding of Silicon Wafers
De-bonding and Removal of Wax |Removal of AquaBond 55 & 85 | De-bonding of AD4110-A/AD4105-B

 

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