De-bonding of Silicon Wafers Adhered with VALTRON® Adhesives to Glass using VALTRON® Detergents - Valtech Corporation
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De-bonding of Silicon Wafers Adhered withValtron Adhesives to Glass using Valtron Detergents

I. Purpose

The purpose of this test was to evaluate the efficiency of the de-bonding of silicon wafers adhered to glass with VALTRON® epoxies.

 

II. Parameters of the Experiment

  1. Conditioning of the Substrates:
    Sliced silicon wafers were submitted by the customer to evaluate de-bonding.  Glass beams cut to 6.5 inches x 2 inches were evenly sanded for improved adhesion. Fifteen (15) silicon wafers evenly spaced were adhered to each glass beam with one of the epoxy systems listed in the table below:
  2. VALTRON Epoxy Ratio (Part A: Part B)
    AD1339-A/AD3905-B 1:1
    AD1339-A/AD3939-B 1:1

  3. Preparation of De-bonding Solutions:
    40% Acetic Acid
    12% & 57% VALTRON® DP164 Epoxy Remover/Detergent
    15% VALTRON® SP2560 High Alkaline Detergent
    50% Citric Acid Solution with Low Foaming Nonionic Surfactant
    16% Lactic Acid, Polyethylene Glycol, & Surfactant Solution
    Deionized Water

    500mL each, of the above solutions were poured into separate 1000mL stainless steel trays. The solutions were heated to, and maintained at temperatures of 131°F/55°C to 194°F/90°C.

III. The Experiment

  1. The VALTRON® epoxy system was prepared by mixing 1 part by weight of the AD1339-A resin with 1 part by weight of the AD3905-B hardener in a mixing cup.
  2. A set of 15 wafers, evenly spaced, were adhered with the epoxy to a glass beam.
  3. The epoxy was allowed to cure for 24 hours at room temperature.
  4. Next, the substrate was given a 15 second spray rinse of low-pressured deionized water at room temperature.
  5. The prepared substrate was placed in the solution and soaked until the wafer de-bonded from the glass beam.  The de-bonding time was recorded.
  6. The experiment was repeated as follows:
    1. Steps 1-5 were repeated using the AD1339-A/AD3905-B epoxy system with 12% VALTRON® DP164 at 131°F/55°C, 12% VALTRON® DP164 at 158°F/70°C, 57% VALTRON® DP164 at 131°F/55°C, 15% VALTRON® SP2560 at 185°F/85°C, 50% Citric acid solution at 131°F/55°C, and 16% Lactic acid solution at 131°F/55°C.
    2. Steps 1-5 were repeated using the AD1339-A/AD3939-B epoxy system with 40% Acetic acid at 158°F/70°C, 12% VALTRON® DP164 at 158°F/70°C, and 15% VALTRON® SP2560 at 185°F/85°C.
    3. Steps 1-5 were repeated using the AD1339-A/AD3905-B epoxy system with deionized water at 194°F/90°C.
  7. The de-bonding times are listed in the table below.

 

IV. Results

De-bonding of Silicon Wafers from Glass Beams

VALTRON Epoxy System De-bonding Solution Conc.
(vol. %)
Soak Temp. (°F/°C) De-bond Time
(min.)
AD1339-A/AD3905-B Acetic acid 40 158/70 4
AD1339-A/AD3939-B Acetic acid 40 158/70 3
AD1339-A/AD3905-B VALTRON DP164 12 158/70 11
AD1339-A/AD3939-B VALTRON DP164 12 158/70 12
AD1339-A/AD3905-B VALTRON SP2560 15 185/85 20
AD1339-A/AD3939-B VALTRON SP2560 15 185/85 30
AD1339-A/AD3905-B VALTRON DP164 12 131/55 12
AD1339-A/AD3905-B VALTRON DP164 57 131/55 11
AD1339-A/AD3905-B Deionized Water - 194/90 38
AD1339-A/AD3905-B Citric Acid Solution 50 131/55 Did not de-bond after
45 minutes of soaking
AD1339-A/AD3905-B Lactic Acid Solution w/PEG 16 131/55 15

 

V. Conclusion

In this experiment, five solutions as well as plain deionized water were evaluated in the de-bonding of silicon wafers from glass beams adhered with VALTRON® epoxies. 40% Acetic acid was capable of de-bonding the wafers in 3-4 minutes. 12% & 57% VALTRON® DP164 de-bonded the wafers in 11 to 12 minutes. A 15% solution of VALTRON® SP2560 de-bonded the wafers in 20 to 30 minutes, and the use of deionized water at 90°C required a de-bonding time of 38 minutes. A 50% Citric acid solution did not de-bond the wafers after 45 minutes of soaking and therefore is not an effective method of de-bonding. A 16% Lactic acid solution fortified with Polyethylene Glycol 300 (PEG 300) resulted in a de-bonding time of 15 minutes. Achieving a de-bonding time below 15 minutes can only be accomplished by soaking the substrates in a 12% solution of VALTRON® DP164 epoxy remover/detergent at a temperature of 131°F/55°C to 158°F/70°C.

 

While the use of 40% Acetic acid solution for de-bonding the silicon wafers from glass beams required the least amount of time as compared to either 12% VALTRON® DP164 or 15% VALTRON® SP2560, it requires special handling and protective equipment such as the use of a respirator and operation under a fume hood in order to minimize worker exposure to the extremely irritating fumes that it generates at elevated temperatures. The VALTRON® DP164 and SP2560, on the other hand, can safely be used under general mechanical ventilation.

 

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Compatibility Testing of Lenses | Removal of DYKEM Layout Fluid | Removal of Polishing Compounds
Removal of Contaminants | Effectiveness of Ultrasonic Cleaning | Etching of Silicon Wafers | De-bonding of Silicon Wafers
De-bonding and Removal of Wax |Removal of AquaBond 55 & 85 | De-bonding of AD4110-A/AD4105-B

 

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