Debonding of VALTRON® AD4110-A / AD4105-B Epoxy System from Glass Plates and Steel Wire Saw Fixture - Valtech Corporation
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De-bonding of VALTRON® AD4110-A / AD4105-B Epoxy System from Glass Plates and Steel Wire Saw Fixture

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Debonding of Valtron AD4110-A / AD4105-B Epoxy System from Glass Plates and Steel Wire Saw Fixture

I. Purpose

The purpose of this test was to determine the adhesives debonding from glass plate and steel fixture at a desired layer thickness.

II. Parameters of Experiment:

  1. Materials:
  2. HCT Wire Saw Adapter Plate – 520 mm x 100 mm x 20 mm - Weight: 17.1 lbs (7.8 kg)
    Glass Plates – Measuring 520 mm x 140 mm x 8 mm – Weight 3.2 lbs (1.5 kg)
    VALTRON AD4110-A - Lot # 060915
    VALTRON AD4015-B - Lot # 060831
    Propane Heated Water Bath
    Measuring 14” Diameter, Filled with 9 Gallons (34 Liters) or 75 lbs ( 34.1 Kg) of Water

III. The Experiment

1. Bonding

  1. The steel adapter plate and glass plate were cleaned with Isopropyl Alcohol.
  2. The steel plate was prepared by applying 4 strips of duct tape measuring 10 mm in width to both edges of the steel plate as shown below. The thickness of the 4 strips measured 1.1 mm.
  3. 30 grams of the AD4110-A and 15 grams of the AD4015-B epoxy were thoroughly mixed in a 100 cc mixing cup.
  4. The epoxy mixture was placed onto the steel fixture and drawn down the length of the fixture using a wooden spatula. The tape was used to ensure an even epoxy thickness of 1.1 mm.
  5. The sandblasted side of the glass plate was placed on top of the steel fixture using very minor hand pressure.
  6. The assembly was allowed to cure for 90 minutes.
  7. The total weight of the assembly was measured to be 20.25 lbs (9.2 Kg)

Figure 1 – Cross Section of Assembled Fixture and Glass Plates


2. De-bonding

  1. The water bath was heated to 98C.
  2. Following the 90 minute cure of the epoxy adhesive system the bonded assembly was placed into the water bath.
  3. The temperature of the water bath was measured during the debonding process and was noted to be 98C, 30 seconds after placing the assembly into the bath. The temperature dropped to 97C 83 seconds after the assembly was placed into the bath.
  4. 105 seconds after the assembly was placed into the bath the glass and adhesive completely debonded from the steel fixture. 4 seconds later the adhesive debonded from the glass plate.


IV. Results

The adhesive floated on the top of the water making it very easy to remove.


V. Conclusion

The AD4110-A / AD4015-B epoxy system can be debonded from the glass plate and steel fixture when a 1.1 mm thickness layer is applied. The ratio of water weight to specimen weight was 3.7:1 and is considered to be a critical factor in the ability of the epoxy to be removed in a timely manner. It is important the temperature of the debonding solutions be in the range of 92°-98°C and not go above or below this range at all times.


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Compatibility Testing of Lenses | Removal of DYKEM Layout Fluid | Removal of Polishing Compounds
Removal of Contaminants | Effectiveness of Ultrasonic Cleaning | Etching of Silicon Wafers | De-bonding of Silicon Wafers
De-bonding and Removal of Wax |Removal of AquaBond 55 & 85 | De-bonding of AD4110-A/AD4105-B


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