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Formulated Detergents Molded Polymers Epoxy Adhesives
Valtech Corporation

 

 

 

 

 

Heat Release Epoxy Systems

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Component Properties MIXED System Properties
Epoxy System Appearance Viscosity (cps @ 25°C) Density (g/cc) Mixing Ratio
(by volume)
Gel Time (min) Cure Time
(hrs)
Hardness (Shore "D") Bond Strength (psi) Applications
4 hrs 8 hrs 24 hrs
AD4010A White 275,000 1.03 2 4 2 73-75 1,100 1,600 2,100 Standard heat release system
AD4015B Yellow 11,500 1.14 1
AD4110A White 80,000 1.09 2 4 2 73-75 1,600 1,900 1,900 Low viscosity system for ingot fixturing, glass beam bonding to wire saw workplate
AD4015B Yellow 11,500 1.14 1
AD4130A Cream 28,000 1.07 2 15 2 55-60 600 850 1,000 Extremely low viscosity, longer gel time
AD4019B Orange 1,000 1.12 1
AD4135A Cream 30,000 1.07 2 15 2 55-60 400 850 1,100 Extremely low viscosity, longer gel time, spherical spacers included
AD4019B Orange 1,000 1.12 1
AD4010A White 275,000 1.03 2 7 2 52-54 350 380 600 Increased gel times system
AD4017B Yellow 13,000 1.14 1
AD4180A White Paste 1.08 2 5 2 64-66 1,000 1,650 1,700 Non-sag system used for vertical surface mounting
AD4180B Yellow Paste 1.01 1
AD4500 Tan 38,000 1.23 80* UV curable system for protective coatings, transparent substrate bonding
Shore A Hardness TB-AD4000MATRIX, Rev. G, 1/26/2012
 

Compatibility Testing of Lenses | Removal of DYKEM Layout Fluid | Removal of Polishing Compounds
Removal of Contaminants | Effectiveness of Ultrasonic Cleaning | Etching of Silicon Wafers | De-bonding of Silicon Wafers
De-bonding and Removal of Wax |Removal of AquaBond 55 & 85 | De-bonding of AD4110-A/AD4105-B

 

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