Fiber Optics - Valtech Corporation
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Fiber Optics

Valtech’s encapsulating and potting epoxy compounds for fiber optics assemblies provide fixation and potting properties to fiber bundles during the assembly of fiber optics. These compounds are designed for increased working times at ambient conditions with reduced cure time at elevated temperatures. The reasonable ductility along with improved high temperature properties provides to required process conditions. These products can be used for sealing fiber bundles into ferrules, fiber component packaging, and fiber optic sensors for medical devices.

 

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AD7013-A/B Filling & Potting Compound

 

 
 
 
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Compatibility Testing of Lenses | Removal of DYKEM Layout Fluid | Removal of Polishing Compounds
Removal of Contaminants | Effectiveness of Ultrasonic Cleaning | Etching of Silicon Wafers | De-bonding of Silicon Wafers
De-bonding and Removal of Wax |Removal of AquaBond 55 & 85 | De-bonding of AD4110-A/AD4105-B

 

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