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Formulated Detergents Molded Polymers Epoxy Adhesives
Valtech Corporation

 

 

 

 

 

Ingot Mounting Adhesive Systems

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Component Properties MIXED System Properties  Slurry Compatibility 
Epoxy System Appearance Viscosity
(cps @
25°C )
Density (g/cc) Mixing
Ratio
(by volume)
Gel
Time
(min)*
Cure
Time
(hrs)**
Moveable
Time
(min)****
Hardness (Shore
 "D"
)
Bond
Strength
(psi)
Glass Transition
Temp.
C ***
Applications PEG   PEG/
Water
Water
4 hrs 8 hrs
AD1230A Gray 35,000 1.21 10 50 5 240 82 500 1,700 40 Long cure time, water resistant, removal requires acid
AD1210B Green 3,500 1.08 1
AD1265A Gray 55,000 1.20 2 35 4 180 83 1,300 2,400 45 For use in water-based slurry or coolant applications
AD1265B Green 15,000 1.20 1
AD1238A Gray 70,000 1.21 1 5 2 30 84 2,200 2,700 35 Fast curing, high bond strength system    
AD3848BR Red 25,000 1.31 1
AD1238A Gray 70,000 1.21 1 15 4 60 84 2,200 2,700 35 Increased gel time version of AD1238A / AD3848BR system    
AD3853B Red 23,000 1.31 1
AD1339A White 115,000 1.65 1 15 2 60 85 1,800 1,800 40 Increased hardness system to prevent wire marks    
AD3939B Blue 43,000 1.47 1
AD1339A White 115,000 1.65 1 30 4 60 85 1,800 2,000 40 Increased gel time version of AD1339A / AD3939B    
AD3905B Purple 43,000 1.47 1
AD5031A Off-White 52,000 12.7 2 12 4 60 82 1,800 2,000 30 Maintains bond strength after 24 hr. cure, resists wafer drop & chipping
AD5031B Blue Purple 23,000 9.9 1
AD5032A White 50,000 11.8 1 12 4 60 82 1,800 1,900 30 Maintains bond strength after 24 hr. cure, resists wafer drop & chipping
AD5032B Red 60,000 11.5 1
AD1846A White 80,000 1.26 2 10 4 60 80 1,000 1,800 45 Water Based Slurry / Coolant Applications
AD1846B Green 20,000 1.26 1

** 
*** 
**** 
Gel time condition 100 g @ 25ºC
Cure time conditions @ 25ºC
Glass transition temperature using DSC Method
Moveable time @ 25ºC, time required before significant movement of mounted ingot
TB-IngotEpoxyMatrix, Rev. J, 1/30/2012
 

Compatibility Testing of Lenses | Removal of DYKEM Layout Fluid | Removal of Polishing Compounds
Removal of Contaminants | Effectiveness of Ultrasonic Cleaning | Etching of Silicon Wafers | De-bonding of Silicon Wafers
De-bonding and Removal of Wax |Removal of AquaBond 55 & 85 | De-bonding of AD4110-A/AD4105-B

 

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