Epoxy Adhesives - Valtech Corporation
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Epoxy Adhesives

VALTRON® epoxy adhesive systems are available in various formulations designed for use to meet the specific needs and performance requirements in photovoltaic and semiconductor wafer production using both annular (ID) slicing and wire saw slicing processes. These patented two-component quick-curing adhesive systems are made with unique components and performance characteristics to maximize production throughput and reduce the amount of stress occurring between the crystalline material and the adhesive. This reduction in stress results in a decrease in the amount of edge chips that occur during slicing. VALTRON adhesives prevent loading onto the annular saw and will eliminate saw marks, increase saw blade life, and improve slicing yields. Easy removal of the epoxy from the wafers with a VALTRON heated detergent solution eliminates the need for aggressive acids, caustics, and solvents. VALTRON adhesives are color pigmented to easily indicate when a complete mix of resin and hardener is achieved, and provide fast cure times at room temperature.

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Compatibility Testing of Lenses | Removal of DYKEM Layout Fluid | Removal of Polishing Compounds
Removal of Contaminants | Effectiveness of Ultrasonic Cleaning | Etching of Silicon Wafers | De-bonding of Silicon Wafers
De-bonding and Removal of Wax |Removal of AquaBond 55 & 85 | De-bonding of AD4110-A/AD4105-B


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