Chemically Formulated Solutions for Semiconductor Wafer Processing - Valtech Corporation
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Semiconductor Wafering

Valtech has supplied VALTRON® temporary bonding adhesive systems, ingot support beams, and formulated detergents for the semiconductor wafer process for nearly 20 years. These products have evolved along with the technology as it has transitioned from annular (ID) slicing to multi-wire saw slicing. Our commitment to meeting our customer’s requirements as technology changes has allowed us to continue to develop new and innovative solutions for the semiconductor market. Although the general processing of semiconductor wafers is considered to be consistent throughout the industry, we realize that each customer has specific requirements that call for unique solutions. Our extensive technical expertise and ability to work closely with our customers allows us to provide these solutions.

 

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Compatibility Testing of Lenses | Removal of DYKEM Layout Fluid | Removal of Polishing Compounds
Removal of Contaminants | Effectiveness of Ultrasonic Cleaning | Etching of Silicon Wafers | De-bonding of Silicon Wafers
De-bonding and Removal of Wax |Removal of AquaBond 55 & 85 | De-bonding of AD4110-A/AD4105-B

 

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